Warning: file_put_contents(): Only 0 of 4845 bytes written, possibly out of free disk space in /home/www/wwwroot/zidian/001308.com/index.php on line 55 99精品免费观看,国产资源在线观看入口
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自動粘片機是將半導體晶圓微芯片貼裝到引線基架的半導體后工序關(guān)鍵性生產(chǎn)設(shè)備。