flip chip

基本解釋

This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介紹了芯片倒裝焊的重要意義、發(fā)展趨勢、基本的焊球類型、制作方法及焊球質(zhì)量的檢測技術(shù)。
This text introduces the technology of flip chip, from origins to the development of now, then an evaluation of the advantage in craft and electricity aspectses is made.
文章主要介紹了倒裝片技術(shù)從起源到現(xiàn)在的發(fā)展狀況，并對倒裝片的工藝優(yōu)點及電氣方面的優(yōu)點作出評價，提出倒裝片將成為今后大型計算機組裝工藝中的關(guān)鍵技術(shù)。
The methods of 3D interconnection can be classified into the wire bonding, flip chip, through silicon via(TSV) and film wire technology, whose advantages and disadvantages are analyzed.
將實現(xiàn)3D互連的方法分為引線鍵合、倒裝芯片、硅通孔、薄膜導(dǎo)線等，并對它們的優(yōu)缺點進行了分析。