ic fabrication process

基本解釋

The affection factors and causations generating process antenna effect (PAE) in the IC fabrication process are analyzed.
天線效應(yīng)（PAE）是超深亞微米IC設(shè)計(jì)后端設(shè)計(jì)流程中的一個(gè)關(guān)鍵問題。
The stochastic nature of the IC fabrication process and the resulting difficulties in the process control are described.
本文說明了IC生產(chǎn)工藝的隨機(jī)性及其給工藝控制和決策帶來(lái)的困難。
This paper reports a buried channel structure for low power transverse voltage type IC pressure transducer. The fabrication and process computer simulation has been completed successfully.
本文提出一種低功耗埋溝式橫向電壓型集成壓力傳感器結(jié)構(gòu)，并根據(jù)精確的工藝模型成功地進(jìn)行了工藝計(jì)算機(jī)模擬程序和制作。