semiconductor bonding wafer

基本解釋

Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass.
半導體硅與玻璃的靜電鍵合技術是微電子機械系統(tǒng)（MEMS）的關鍵技術，而作為關鍵材料之一的靜電鍵合玻璃有著廣闊的工業(yè)應用前景。
Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.
晶圓鍵合可以使得經(jīng)過拋光的半導體晶圓在不使用粘結劑的情況下結合在一起。