soic

基本解釋

Dambar inspection is only for SOIC devices.
Dambar 檢測只適用于 SOIC器件.
The device is available in an 8-pin SOIC package with exposed thermal pad (suffix LJ).
該器件采用8引腳SOIC封裝,帶有外露熱傳導(dǎo)墊片(后綴LJ)。
This new device is intended to also be offered in a plastic 8-pin SOIC surface mount package starting in approximately September 2007.
此款新器件自2007年9月左右起還將提供8引腳塑膠SOIC表面安裝封裝。
The A3423 is available in a 4-pin SIP and a plastic 8-pin SOIC surface mount package (the SOIC version is currently in development).
A3423采用4引腳SIP及塑膠8引腳SOIC表面安裝封裝(SOIC版本目前正在開發(fā)中)。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
該器件提供兩種封裝：24引腳、0.;3英寸寬、塑料密封雙列直插式封裝（DIP）和24引腳小形集成封裝（SOIC）。