solder ball

基本解釋

With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.
熱循環(huán)模擬是在封裝、焊球和PCB基板的任一節(jié)點上施加相同的溫度載荷，忽略了整個封裝體內(nèi)溫度梯度的存在。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介紹了激光重熔在面陣列封裝釬料凸點成形中的研究進展，并且對PBGA共晶釬料球激光重熔進行了工藝研究。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn′t been vastly applied presently.
激光植球的優(yōu)勢在于它的柔性，它適宜于中小批量BGA的生產(chǎn)與個別焊球的修復，不過目前還沒有投入大規(guī)模的應(yīng)用。

焊球
Adaptive algorithm is used to realize IMC growth during simulation, and energy fatigue model is used to predict solder ball lifetime.
采用改進算法,在計算過程中引入了IMC厚度的變化,利用能量法預測了焊球壽命。
能源科學技術(shù)
焊點
The electromagnetic stirring was carried out in the process of solder joint formation in the lead-free solder ball and substrate by means of revolving permanent magnets. Consequently, some defects were found through analysis, causing negative impacts on solder joints reliability.
利用旋轉(zhuǎn)永磁體法對無鉛焊料球和基板在受熱形成焊點的過程中實施電磁攪拌,試驗之后,通過分析結(jié)果,發(fā)現(xiàn)該方法存在缺陷,對焊點可靠性有不利影響。
計算機科學技術(shù)
焊錫球