ulsi

基本解釋

This paper describes the development of phase shifting lithography and its applications in ULSI technology.
本文綜述了相移光刻技術(shù)的發(fā)展及其在ULSI中的應(yīng)用。
Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介紹了ULSI多層銅互連線中的碟形坑問題，對(duì)其產(chǎn)生的原因及影響因素進(jìn)行了分析。
In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.
本論文主要研究了ULSI中銅互連線的微觀結(jié)構(gòu)和應(yīng)力及其對(duì)與電徙動(dòng)MTF的影響。