underfill

基本解釋

DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
簡(jiǎn)介：道爾DU901是一種單組分環(huán)氧密封劑，用于CSP或BGA底部填充制程。
T hen show that correct underfill can dramatically increase thermal reliability.
通過(guò)正確的底部填充，可提高倒裝芯片組裝的成品率和可靠性。
This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.
這使得完整意義上說(shuō)，這是其次的圖片現(xiàn)代芯片的顛簸和底層指出。
The results show that the residual moisture within underfill materials enhances the stress level in solder joint.
結(jié)果表明：在濕熱環(huán)境下，底充膠材料內(nèi)部殘留的濕氣提高了焊點(diǎn)的應(yīng)力水平。
A cure-dependent viscoelastic model was applied to describe the mechanical behavior of underfill.
利用有限元仿真的方法，模擬了無(wú)鉛倒裝封裝器件封裝的工藝及可靠性測(cè)試。