sputtering target

基本解釋

Uses: sputtering target, physical vapor deposition, high temperature alloys.
濺射靶材、物理氣相沉積、高溫合金。
Uses: sputtering target, physical vapor deposition, high temperature alloy for high-voltage vacuum switch contacts and precision alloy additives.
用途：濺射靶材、物理氣相沉積、高溫合金、用于高壓真空開關(guān)觸頭及精密合金添加劑。
The traditional upper limit of magnetic induction density B parallel to target surface in rectangular planar magnetron sputtering target has been increased by analyzing, designing and experimenting.
通過理論分析、實際設(shè)計和實驗，對矩形平面磁控濺射靶表面水平磁感應(yīng)強度B的傳統(tǒng)取值上限進行了拓展。
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