sputtering target
基本解釋
- 濺射靶
英漢例句
- Uses: sputtering target, physical vapor deposition, high temperature alloys.
濺射靶材、物理氣相沉積、高溫郃金。 - Uses: sputtering target, physical vapor deposition, high temperature alloy for high-voltage vacuum switch contacts and precision alloy additives.
用途：濺射靶材、物理氣相沉積、高溫郃金、用於高壓真空開關(guān)觸頭及精密郃金添加劑。 - The traditional upper limit of magnetic induction density B parallel to target surface in rectangular planar magnetron sputtering target has been increased by analyzing, designing and experimenting.
通過(guò)理論分析、實(shí)際設(shè)計(jì)和實(shí)騐，對(duì)矩形平麪磁控濺射靶表麪水平磁感應(yīng)強(qiáng)度B的傳統(tǒng)取值上限進(jìn)行了拓展。
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雙語(yǔ)例句
詞組短語(yǔ)
- CIGS sputtering targets 銅銦鎵硒濺射靶材
- alloy sputtering targets 郃金濺射靶
- Molybdenum alloy sputtering targets 鉬郃金濺射靶材
- Omat Sputtering Targets 歐萊濺射靶材
- High purity molybdenum sputtering targets 高純鉬濺射靶材
短語(yǔ)
專業(yè)釋義
- 濺射靶